Advanced alloys engineered to meet the reliability demands of specific applications, ensuring optimal performance under challenging conditions.
Our high-reliability alloys enhance creep resistance, thermomechanical performance, and vibration resistance, while low-temperature alloys lower reflow temperatures to reduce warpage and protect heat-sensitive components in challenging environments.
A lead-free alloy delivering best-in-class yield, outperforming Sn/Cu-based materials.
Suitable for wave soldering and selective soldering for electronic assemblers interested in implementing a lead-free process.
Suitable for wave soldering and selective soldering for electronic assemblers interested in implementing a lead-free process.
Proven to significantly enhance thermal cycling, vibration, and drop shock performance over existing high-reliability offerings.
SAC-based formulation designed in collaboration with the automotive industry for high-temperature and vibration environments.
A low temperature lead-free alloy designed to exhibit improved thermomechanical reliability and soldering performance.
Silver-free lead-free alloy for wave, selective and rework applications.
Manufactured through a specialized process that controls the inclusion of oxides and metallic and non-metallic impurities.
ALPHA® Vaculoy® Solid Solder、Low and No-Silver Lead Free Alloys
Solder alloys are essential for ensuring that assemblies can withstand thermomechanical strain in harsh operating environments. Our high-reliability alloys, including industry-standard ALPHA® Innolot and the next-generation ALPHA Innolot MXE, enhance thermomechanical reliability, creep resistance, and vibration performance. These alloys are designed for critical electronics in demanding sectors like automotive and aerospace, offering continuous operating temperatures above 125°C to maximize system-level reliability.
The choice of solder alloy is crucial for system-level reliability. High-reliability alloys are engineered to endure thermal and mechanical stress in harsh environments, ensuring extended in-use life. Low-temperature alloys, ideal for applications under 100°C, offer protection for heat-sensitive components, balancing advanced capabilities with the precision needed for these demanding sectors. These alloys are perfect for industries like computing and mobile phones, featuring optimized process parameters and cascade reflow capability to enhance manufacturing efficiency and product durability.
For most electronic assembly applications, low- and no-silver lead-free solder alloys offer reliable performance at a lower cost. Thicker assemblies, those in harsh environments, or high-power applications typically require higher silver alloys.
We include an extra step in our manufacturing process to remove oxides. The Vaculoy process helps reduce dross rates and improves solder efficiency for our customers.
Yes, we produce alloys in shapes and sizes compatible with most selective soldering equipment. Additionally, we offer low/no silver alloys without antioxidants, ideal for certain selective soldering applications.