Enabling reliable electronics packaging for automotive, telecommunications, high-performance computing and other key industries.
Our solder preforms offer precise volume control, enhancing reliability and performance. By improving solder joint quality, minimizing voids, and managing flux residues, our products ensure durable, high-quality connections in electronics packaging.

Designed to enhance reliability and heat transfer through the reduction of voiding under bottom termination components.
Solder Preforms engineered to enhance reliability and heat transfer through the reduction of voids on surfaces.
Provides a precise fit, controlled solder volume, consistent flux levels, and a wide alloy range for industrial applications.
Used in PCB assembly and integration into higher-level assemblies, serving as the primary solder for a range of devices.
Delivers consistent bondline thickness (BLT) and minimizes die tilt, resulting in predictable reliability and performance.
ALPHA® TrueHeight® Preforms、ALPHA® Exactalloy® Tape & Reel Solder Preforms……
We ensure each solder preform is made with precise solder volume and flux consistency. This guarantees repeatable, reliable soldering results, essential for the optimal performance and longevity of components.
Our solder preforms are available in various sizes, tailored to fit perfectly over or into tough-to-solder areas, such as connector pins and densely packed PCB assemblies. With stringent process controls, we ensure consistent solder volume and minimal flux, delivering reliable, high-quality results every time.
We offer a wide selection of alloys for our solder preforms, with melting points ranging from 47°C (117°F) to over 300°C (572°F). Whether customers require a low-temperature solution or one for higher-temperature applications, we provide the right alloy to meet their specific needs.