Solder Pastes
Advanced solutions designed to meet the evolving demands of electronics assembly.
Improve Your Electronics Production Efficiency
Meticulously developed solder pastes designed to address key challenges in electronics assembly, including electrochemical reliability, miniaturization, high throughput, and yield, while offering a wide processing window to reduce TCO.
ALPHA® CVP-390 Innolot Solder Paste
High-reliability no-clean solder paste engineered to deliver advanced thermomechanical performance.
ALPHA® CVP-390 Solder Paste
Lead-free, no-clean solder paste, that maximizes process flexibility, ensuring electrochemical reliability in tough applications.
ALPHA® CVP-520 Solder Paste
Enables low temperature SMT assembly technology to minimize rework in multiple reflow applications.
ALPHA® JP-500 Solder Paste
Lead-free, zero halogen, no-clean solder paste suitable for jet printers and approved by leading jetting equipment manufacturers.
ALPHA® JP-501 Solder Paste
A low temperature, lead-free, no-clean solder paste designed for use in jet printers.
ALPHA® OM-100 SnCx® 07 Paste
Optimized for value, designed for reliability, and featuring a silver-free solder solution that delivers SAC-level performance.
ALPHA® OM-353 Solder Paste
Broad latitude for high-reliability applications requiring process flexibility and residue containment, lead-free and zero-halogen.
ALPHA® OM-5100 Solder Paste
Low residue, no-clean solder paste designed to maximize first pass yields with a rheologically formulated flux vehicle.
More Products
ALPHA® OM-565 HRL3 Solder Paste、ALPHA® WS-826 Solder Paste、ALPHA® OM-5300 Solder Paste……
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常见问题
Are MacDermid Alpha solder pastes RoHs and reach compliant?
Yes, the majority of our solder pastes are RoHS and REACH compliant. For specific details on regional regulatory requirements, please contact your local representative.
How can solder paste help improve my assembly process?
Our modern chemistries are designed to perform under a variety of process conditions, offering a wide processing window while increasing throughput. These chemistries ensure consistent soldering performance, enhancing joint reliability and helping reduce warranty costs.
Do you have a solution to lower voiding levels on QFNs/QFPs?
We offer an ultra-low voiding solder paste solution that consistently achieves voiding levels of less than 10% for components with large thermal pads, such as QFNs and QFPs.
What powder types are available?
We offer a wide particle size ranging from type 3 to type 6.